Photosensitive Assembly and Camera Module and Manufacturing Method Thereof

ABSTRACT

A camera module and its photosensitive assembly and manufacturing method thereof are provided. The photosensitive assembly includes a photosensitive element, a window circuit board and a packaging body integrally packaged the photosensitive element and the window circuit board to form an integrated body, wherein the window circuit board has at least one window for receiving the photosensitive element therein.

CROSS REFERENCE OF RELATED APPLICATION

This is a Continuation application that claims priority under 35 U.S.C.§ 120 to a non-provisional application, application Ser. No. 15/473,565,filed Mar. 29, 2017, which claims priority under 35 U.S.C. § 119 toChinese application number CN 20161051660.2, filed and Jul. 3, 2016 andChinese application number CN 201620691699.5, filed Jul. 3, 2016,wherein the entire contents of each of which are expressly incorporatedherein by reference.

NOTICE OF COPYRIGHT

A portion of the disclosure of this patent document contains materialwhich is subject to copyright protection. The copyright owner has noobjection to any reproduction by anyone of the patent disclosure, as itappears in the United States Patent and Trademark Office patent files orrecords, but otherwise reserves all copyright rights whatsoever.

BACKGROUND OF THE PRESENT INVENTION Field of Invention

The present invention relates to camera module, and more particularly toa molded camera module and its photosensitive assembly and manufacturingmethod thereof.

Description of Related Arts

The conventional camera modules are usually packaged through the COB(Chip On Board) process, as a relatively mature packaging technology,COB package has its advantages, while it also has many disadvantages.

The conventional camera module typically includes a circuit board, aphotosensitive element (or photosensitive chip) , an optical filter, abase, a driver, a lens, and electronic (resistor-capacitor) components.These components are packaged through the COB process, and thephotosensitive chip is connected on the circuit board, the opticalfilter is mounted on the base and positioned in a photosensitive path ofthe photosensitive chip, the driver is mounted on the circuit board, andthe lens is mounted on the driver to position the lens be aligned in thephotosensitive path of the photosensitive chip and adjust a focal lengthof the camera module by the driver.

Firstly, in such a conventional manner, the photosensitive chip isattached on an upper surface of the circuit board. In this process, thephotosensitive chip is usually adhered to the circuit board by gluebonding. For the camera module, the uniformity of the optical axis is avery important aspect and, therefore, the requirement of the flatness ofthe circuit board and the photosensitive chip is relatively high so asto further coincide the main optical axis of the lens with the centraloptical axis of the photosensitive chip.

Secondly, the base is fixed to the circuit board in an adhering manner,and the filter, the driver and the lens components are all depend on thebase. Therefore, the flatness of the base itself and the flatness of theinstalling operation are highly demanded.

Thirdly, the photosensitive chip is electrically connected to thecircuit board through one or more gold wires and the resistor-capacitorcomponents are protruded from the circuit board. Therefore, when thebase is installed, a space must be reserved for the gold wires and theresistor-capacitor components while the gold wires and theresistor-capacitor components must be kept not in touch with each otherin all directions. This results in unnecessary space occupation. On theother hand, the resistor-capacitor components are easily contaminatedwith dust and debris, which does influence the imaging quality of thecamera module and cause the formation of black spots.

Fourthly, it is also a relatively important aspect that, correspondingto the development of various intelligent devices, such as smart phones,a lighter and thinner camera module is increasingly needed that thecamera module is developed to have been extremely miniaturized, so thatto minimize its space to be occupied is very important. However, in theabove assembling process, the photosensitive chip, the circuit board andthe resistor-capacitor components all take up space, which makes thesize of the conventional camera module being very difficult to bereduced. In such an adhesive-type structure, since the photosensitivechip has a certain thickness, it is necessary to provide a space for thephotosensitive chip to be attached on and protruded from the circuitboard while mounting other components before mounting the base.

Fifthly, the height of the camera module is required to meet therequirement of optical imaging. In this conventional assembly process,the photosensitive chip is attached to the circuit board and the opticalfilter is mounted on the base, so that the back focus of the cameramodule is large and the overall height of the camera module is largetoo.

SUMMARY OF THE PRESENT INVENTION

The main object of the invention is to provide a packaged camera moduleand its photosensitive assembly and manufacturing method thereof,wherein the photosensitive assembly comprises a photosensitive element,a window circuit board and a packaging body, wherein the photosensitiveelement and the window circuit board are integrally connected andpackaged by the packaging body.

Another object of the invention is to provide a packaged camera moduleand its photosensitive assembly and manufacturing method thereof,wherein the photosensitive element and the window circuit board areintegrally packaged by the packaging body in an overlapping manner, soas to reduce the relative height of the photosensitive element and thewindow circuit board.

Another object of the invention is to provide a packaged camera moduleand its photosensitive assembly and manufacturing method thereof,wherein the window circuit board has a window for receiving thephotosensitive element therein such that the installation of thephotosensitive element will not increase the thickness of the windowcircuit board and thus the relative height of the photosensitive elementand the window circuit board can be minimized, so as to minimize theheight of the packaged camera module.

Another object of the invention is to provide a packaged camera moduleand its photosensitive assembly and manufacturing method thereof,wherein the window of the window circuit board is a central through holethat renders the photosensitive element and the window circuit boardhaving an adjustable relative height so as to enable the presentinvention to adapt for various circuit boards having differentthickness.

Another object of the invention is to provide a packaged camera moduleand its photosensitive assembly and manufacturing method thereof,wherein the bottom of the photosensitive element is exposed to outsideto improve the heat dissipation performance of the photosensitiveelement.

Another object of the invention is to provide a packaged camera moduleand its photosensitive assembly and manufacturing method thereof,wherein the photosensitive element and the window circuit board areelectrically connected with each other by one or more connecting wireswhich are integrally packaged by the packaging body.

Another object of the invention is to provide a packaged camera moduleand its photosensitive assembly and manufacturing method thereof,wherein the photosensitive assembly comprises a photosensitive element,a window circuit board having a window receiving the photosensitiveelement therein and an optical filter which is provided above thephotosensitive element to shelter and protect the photosensitive elementfrom any contaminant and reduce the back focal length of the packagedcamera module.

Another object of the invention is to provide a packaged camera moduleand its photosensitive assembly and manufacturing method thereof,wherein the packaging body comprises a lens portion extended upwardlyand integrally, adapted for being mounted with the lens of the packagedcamera module, so as to provide a flat and stable mounting condition.

Another object of the invention is to provide a packaged camera moduleand its photosensitive assembly and manufacturing method thereof,wherein the packaging body can be downwardly extended to the bottom ofthe photosensitive assembly and packaged from a lower portion of thephotosensitive assembly.

In order to achieve the foregoing and other objects and advantages ofthe present invention, the present invention provides a photosensitiveassembly, which comprises at least one photosensitive element, at leastone window circuit board having a window receiving the photosensitiveelement therein, and at least one packaging body, wherein thephotosensitive element and the window circuit board are integrallypackaged by the packaging body to form the photosensitive assembly as anintegral body, wherein the packaging body forms a light window thereincorresponding to the photosensitive element to define a photosensitivepath thereof, wherein the window circuit board comprises a board bodyhaving an indention forming the window sized and shaped for receivingthe photosensitive element therein.

In some embodiments, the window is a recess and the photosensitiveelement is received and installed in the recess.

In some embodiments, the photosensitive element and the board body ofthe window circuit board are electrically connected by one or moreelectrical connectors, wherein one end of each of the electricalconnectors is connected with the photosensitive element, and another endof the respective electrical connector is connected to a top surface ofthe board body, wherein the top surface of the board body is locatedaround the window.

In some embodiments, the photosensitive element and the board body ofthe window circuit board are electrically connected by one or moreelectrical connectors, wherein one end of each of the electricalconnectors is connected to the photosensitive element, and another endof the respective electrical connector is connected to a top surface ofthe board body that is positioned within the window.

In some embodiments, the window is a through hole and the photosensitiveelement is received and positioned in the through hole.

In some embodiments, the photosensitive element is electricallyconnected by one or more electrical connectors, wherein one end of eachof the electrical connectors is connected with the photosensitiveelement, and another end of the respective electrical connector isconnected to a top surface of the board body.

In some embodiments, the photosensitive assembly comprises a substrate,which is provided below the photosensitive element.

In some embodiments, the photosensitive assembly comprises a substrate,wherein the substrate is provided in the window and has a recessed shapeto receive the photosensitive element therein.

In some embodiments, the one or more electrical connectors areintegrally packaged by the packaging body.

In some embodiments, the photosensitive assembly comprises at least oneelectronic component which is protruded or partially protruded from theboard body and integrally packaged by the packaging body.

In some embodiments, the photosensitive element has a photosensitivearea and a non-photosensitive area, wherein the packaging bodyintegrally packages at least part of the non-photosensitive area.

In some embodiments, the photosensitive assembly further comprises aring-shaped blocking member which is provided around the photosensitivearea of the photosensitive element.

In some embodiments, the packaging body has a step-shaped surface.

In some embodiments, the packaging body has a flat surface.

In some embodiments, the packaging body comprises a holding portion anda lens portion, wherein the lens portion has an exterior extendedintegrally along the holding portion and an interior having astep-shaped structure, wherein the holding portion is provided formounting an optical filter thereon and the lens portion is provided formounting a lens therein.

In some embodiments, the lens portion has a flat interior surface whichis adapted for mounting an unthreaded lens thereon.

In some embodiments, the lens portion has a threaded interior surfacewhich is adapted for mounting a threaded lens.

In some embodiments, the board body has a reinforcing hole, wherein thepackaging body is extended into the reinforcing hole.

In some embodiments, the board body has a reinforcing hole, wherein thepackaging body passes through the reinforcing hole and extends to thebottom of the board body.

In some embodiments, the photosensitive assembly comprises an opticalfilter, which is installed on top of the photosensitive element.

In some embodiments, the photosensitive assembly comprises an opticalfilter, which has an edge integrally packaged by the packaging body.

In some embodiments, the photosensitive assembly comprises a backplane,which is fittingly attached on the bottom of the board body.

In some embodiments, the integral package body is made by molding.

According to another aspect of the present invention, the presentinvention provides a camera module, which comprises a photosensitiveassembly and at least one lens, wherein the lens is located along thelight sensing path (photosensitive path) of a photosensitive element ofthe photosensitive assembly.

In some embodiments, the camera module comprises at least one driverwhich is provided for the lens and is installed at the photosensitiveassembly.

In some embodiments, the camera module comprises at least one holder,wherein the holder is provided at the photosensitive assembly.

In some embodiments, the camera module comprises a plurality ofphotosensitive elements and a plurality of lenses assembled to form anarrayed camera module.

In some embodiments, the window circuit boards of the photosensitiveassemblies are integrally connected with each other.

According to another aspect of the present invention, the presentinvention further provides a method of manufacturing a photosensitiveassembly, which comprises the steps of:

(A) arranging at least a photosensitive element in a window of at leasta window circuit board;

(B) connecting electrically the photosensitive element with the windowcircuit board; and

(C) integrally forming a packaging body with a non-photosensitive areaof the photosensitive element and the window circuit board, wherein alight window is defined in the packaging body above a photosensitivearea of the photosensitive element correspondingly to define aphotosensitive path for the photosensitive element.

In some embodiments, in the step (C), the photosensitive element and thewindow circuit board contact with each other, and the packaging bodyintegrally connects the photosensitive element with the window circuitboard.

In some embodiments, in the step (C), the photosensitive element and thewindow circuit board provide a gap between each other, and the packagingbody is integrally connected and filled between the gap betweenphotosensitive element and the window circuit board to strengthen theconnection of photosensitive element and the window circuit board.

In some embodiments, in the step (C), a medium is provided between thephotosensitive element and the window circuit board to indirectlyconnect the photosensitive element with the window circuit board, andthe packaging body integrally packages the photosensitive element, themedium and the window circuit board to form an integral body.

Additional advantages and features of the invention will become apparentfrom the description which follows, and may be realized by means of theinstrumentalities and combinations that particular point out in theappended claims.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of a camera module according to a firstpreferred embodiment of the present invention.

FIG. 2 is an exploded perspective view of the camera module according tothe above first preferred embodiment of the present invention.

FIG. 3 is a sectional view of the camera module according to the abovefirst preferred embodiment of the present invention.

FIG. 4 illustrates a manufacturing process of the photosensitiveassembly of the camera module according to the above first preferredembodiment of the present invention.

FIGS. 5A and 5B illustrate alternatives of the packaging body of thecamera module according to the above first preferred embodiment of thepresent invention.

FIG. 6 illustrates a first alternative mode of the photosensitiveassembly of the camera module according to the above first preferredembodiment of the present invention.

FIG. 7 illustrates a second alternative mode of the photosensitiveassembly of the camera module according to the above first preferredembodiment of the present invention.

FIG. 8 is a perspective view of a camera module according to a secondpreferred embodiment of the present invention.

FIG. 9 is an exploded perspective view of the photosensitive assembly ofthe camera module according to the above second preferred embodiment ofthe present invention.

FIG. 10 illustrates an alternative mode of the photosensitive assemblyof the camera module according to the above second preferred embodimentof the present invention.

FIG. 11 is a sectional view of a camera module according to a thirdpreferred embodiment of the present invention.

FIG. 12 is a perspective view of the photosensitive assembly of thecamera module according to the above third preferred embodiment of thepresent invention.

FIG. 13 illustrates an alternative mode of the photosensitive assemblyof the camera module according to the above third preferred embodimentof the present invention.

FIG. 14 is a sectional perspective view of a camera module according toa fourth preferred embodiment of the present invention.

FIG. 15 illustrates an alternative mode of the camera module accordingto the above fourth preferred embodiment of the present invention.

FIG. 16 is a sectional view of a camera module according to a fifthpreferred embodiment of the present invention.

FIG. 17 illustrates an alternative mode of the camera module accordingto the above fifth preferred embodiment of the present invention.

FIG. 18 is a sectional view of a camera module according to a sixthpreferred embodiment of the present invention.

FIG. 19 illustrates an alternative mode of the camera module accordingto the above sixth preferred embodiment of the present invention.

FIG. 20 is a sectional view of a camera module according to a seventhpreferred embodiment of the present invention.

FIG. 21 is a sectional view of a camera module according to an eighthpreferred embodiment of the present invention.

FIG. 22 is a sectional view of a camera module according to a ninthpreferred embodiment of the present invention.

FIG. 23 is a block diagram of a manufacturing method of thephotosensitive assembly of the camera module according to the abovepreferred embodiments of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

The following description is disclosed to enable any person skilled inthe art to make and use the present invention. Preferred embodiments areprovided in the following description only as examples and modificationswill be apparent to those skilled in the art. The general principlesdefined in the following description would be applied to otherembodiments, alternatives, modifications, equivalents, and applicationswithout departing from the spirit and scope of the present invention.

It should be understood by those skilled in the art that the orientationor position relationship indicated by the terms “longitudinal”,“transverse”, “up”, “low”, “front”, “rear”, “left”, “right”, “vertical”,“horizontal”, “top”, “bottom”, “inner”, “outer” and so on is based onthe orientation or position relationship shown in the accompanyingdrawings, which is merely for convenience in describing the presentinvention and simplifying the description, and not to indicate or implythat the device or element referred to must be of a particularorientation, constructed and operated in a particular orientation.Therefore, the above-mentioned terms should not be regarded aslimitations to the present invention.

Referring to FIGS. 1 to 4, a camera module according to a firstpreferred embodiment of the present invention is illustrated. The cameramodule comprises at least one photosensitive assembly 10, at least onelens 20 and at least one optical filter 30.

The optical filter 30 is installed on the photosensitive assembly 10 andpositioned at a light sensing path (photosensitive path) of thephotosensitive assembly 10. The lens 20 is positioned along the lightsensing path of the photosensitive assembly 10. For example, duringimage acquisition, the light reflected from the target enters into theinterior of the camera module through the lens 20, and then the light isoptically treated by the lens 20 and the filter 30 and reaches thephotosensitive assembly 10, wherein after the light is sensed by thephotosensitive assembly 10, a photo-electric conversion is processed andthe light signal is converted into an electrical signal, which istransmitted to the electronic apparatus employing the camera module bythe photosensitive assembly 10 to achieve a reproduction of an image,that is, to complete an image acquisition process of a target.

Further, the camera module may further include at least one driver 40,wherein driver 40 is mounted on the photosensitive assembly 10 while thelens 20 is installed within the driver 40 so as to position the lens 20at the light sensing path of the photosensitive assembly 10 so that thefocal length of the camera module can be adjusted by the driver 40. Thedriver 40 may be implemented as a motor, such as, but not limited to, avoice coil motor, a piezoelectric motor, and the like. In other words,in this first embodiment of the present invention, the camera module isan Automatic Focus Model (AFM). Of course, in other embodiments of thepresent invention, the camera module may also be other types, such as aFix Focus Model (FFM). It should be understood by those skilled in theart that the camera module of the present invention should not belimited to the above-mentioned types.

The optical filter 30 may be an infrared cut filter, a wafer levelinfrared cutoff filter, or a blue glass filter. It should be understoodby those skilled in the art that the filter 30 of the present inventionshould not be limited to the above-mentioned types of optical filter.

The photosensitive assembly 10 includes at least one photosensitiveelement 11, at least one window circuit board 12 and at least one ringshaped packaging body 13. The photosensitive element 11 and the windowcircuit board 12 are spatially overlapped, for example thephotosensitive element 11 is embodied to be received within a window ofthe window circuit board 12, so as to reduce the relative height oroverall thickness of the photosensitive element 11 and the windowcircuit board 12, wherein the photosensitive element 11 and the windowcircuit board 12 are integrally packaged by the packaging body 13.

The packaging body 13 has at least one light window 134 for providing alight path for the photosensitive element 11. In other words, the lightentered into the lens 20 passes through the light window 134 and reachesthe photosensitive element 11 for photo-electrical conversion.

In this first embodiment of the present invention, the packaging body 13has a ring shape and a step-shaped inner side structure to function asan installation site to facilitate the installation of the opticalfilter 30 thereon. Of course, the step-shaped inner side structure mayalso be used for mounting the driver 40 and/or the lens 20 thereon. Itshould be understood by those skilled in the art that the components tobe mounted in the packaging body 13 are not limiting in the presentinvention.

The photosensitive element 11 includes a top surface 111 and a bottomsurface 112. The top surface 111 of the photosensitive element 11 facesthe lens 10 for photoelectric conversion.

Further, the photosensitive element 11 is configured to have aphotosensitive area 1111 and a non-photosensitive area 1112 on its topsurface 111, wherein the photosensitive area 1111 is configured to senselight, and the non-photosensitive area 1112 is adapted for electricallyconnecting to the window circuit board 12 to transmit the electricalsignal produced by the photoelectric conversion of the photosensitivearea 1111 to the window circuit board 12. In one embodiment, thephotosensitive element 11 may be implemented as a square CCD or CMOSchip, and the non-photosensitive area 1112 is provided surrounding theperiphery of the photosensitive area 1111. The window circuit board 12may include an embedded circuit for processing an electrical signaltransmitted by the photosensitive element 11.

The packaging body 13 integrally packages at least a portion of thenon-photosensitive area 1112 of the photosensitive element 11. In otherwords, the packaging body 13 may partially package thenon-photosensitive area 1112 of the photosensitive element 11, orcompletely package the non-photosensitive area 1112 of thephotosensitive element 11.

The photosensitive element 11 is electrically connected to the windowcircuit board 12 through one or more electrical connectors 14, so as toconduct electrical signal transmission between the photosensitiveelement 11 and the window circuit board 12. The electrical connectors 14may be embodied as lead wires made of gold, silver, copper, aluminum, orconductive non-metal, such as, but not limited to, gold wire, silverwire, copper wire, and aluminum wire. In one manufacturing method, theelectrical connectors 14 are provided on the photosensitive element 11and the window circuit board 12 by a

WB (Wired/Bond) process. Further, the one or more electrical connectors14 connect the non-photosensitive area 1112 of the photosensitiveelement 11 with the window circuit board 12.

The photosensitive assembly 10 includes one or more electroniccomponents 123 protruding from the window circuit board 12. The one ormore electronic components 123 are electrically connected with thewindow circuit board 12. The electronic component 123 may be a resistor,a capacitor, a driver, a signal processing element, a storage element,or the like. The electronic component 123 can be an electronic component123 of the window circuit board 12 to achieve the electrical signaltransmission. In other embodiments, the one or more electroniccomponents 123 may not be protruded from the window circuit board 12 orthe one or more electronic components 123 can be embedded in the windowcircuit board 12. It should be understood by those skilled in the artthat the type or set mode of the electronic components 123 does notlimit the scope of the present invention.

The electronic components 123 and the electrical connectors 14 arepackaged in the packaging body 13. In other words, the electricalconnectors 14 and the electronic components 123 are wrapped and enclosedby the packaging body 13 and not to be exposed to the externalenvironment. In the conventional camera module, the connecting goldwires and the RC (resistance-capacitance) devices are usually exposed tothe external environment and thus, on the one hand, the dustcontaminated on the gold wires and the resistance-capacitance elementswill adversely influence the imaging quality of the camera module. Inaddition, spaces are required to be reserved and provided for the goldwires and the resistance-capacitance elements on the circuit board andthe independent holder for installing the optical filter and lens isrequired to be adhered on the outer open area around the gold wires andthe resistance-capacitance elements on the circuit board of the cameramodule, which results in a waste of space of the camera module.

The window circuit board 12 includes a board body 121 and has a window122 formed in the board body 121. In other words, the window 122 isindently provided in the board body 121 to form a window-shaped circuitboard. The photosensitive element 11 is received in the window 122 so asto reduce the thickness occupied by the photosensitive element 11 whichis attached on top of the circuit board as in the conventional cameramodule.

That is, the photosensitive element 11 is spatially overlapped with thewindow circuit board 12 by downwardly positioning in the indented window122 of the window circuit board 12 such that the photosensitive element11 is placed inside the board body 121 so that an overall height orthickness the photosensitive element 11 and the board body 121 isreduced to simply the thickness of the board body 121 or slightlythicker than the board body 121 in comparison with the conventionalcamera module that the overall height is the thickness of the circuitboard plus the thickness of the photosensitive element attached on topof the circuit board. When the top surface 111 of the photosensitiveelement 11 is not higher than the top surface 1211 of the board body 121(i.e. the thickness of the photosensitive element is smaller than adepth of the window 122 in the board body 121), the board body 121provides a sufficient space in the window 122 for the photosensitiveelement 11 to be installed therein, and the overall height of thephotosensitive element 11 and the board body 121 is merely as the heightof the board body 121.

The board body 121 has a top surface 1211 and a bottom surface, thepackaging body 13 is arranged to be packaged on the top surface 1211 ofthe board body 121 and extended to be packaged on the non-photosensitivearea of the top surface 111 of the photosensitive element 11. The sizeof the window 122 of the window circuit board 12 may be configured inaccordance with the size of the photosensitive element 11 and may beequivalent to the size of the photosensitive element 11 to make thewindow 122 be adapted to fittingly receive the photosensitive element 11therein, or may be larger than the above-mentioned photosensitiveelement 11 so as to receive the photosensitive element 11 therein whileenabling an adjustment of the position of the photosensitive element 11in the window 122. In one implementation, a gap 125 may be providedbetween the photosensitive element 11 and the window circuit board 12 tofacilitate the photosensitive element 11 to be mounted and affixed withthe window circuit board 12 by filling the gap 125 with the packagingmaterial during the molding and packaging process. In other words, thepackaging body 13 is extended into the gap 125 formed between thephotosensitive element 11 and the window circuit board 12. In oneembodiment, the packaging body 13 extends into the gap 125 to fill thespace between the board body 121 and the photosensitive element 11 thatnot only increases the top surface area, i.e. the installation surfacearea, of the packaging body 13, but also connects and bonds the outerside edges of the photosensitive element 11 with the inner side edges,which defines the window 122, of the board body 121. Also, the packagingbody 13 extended into the gap 125 to bond with the photosensitiveelement 11 and the window circuit board 12 to form an integral bodywhile the bottom surface 112 of the photosensitive element 11 and thebottom surface 1212 of the board body 121 are substantially formed atthe same level. Thus, in other words, the packaging body 13substantially reinforces the photosensitive element 11 and the windowcircuit board 12, as shown in FIG. 3.

It is worth mentioning that, as shown in FIGS. 1-3, the light window 134of the packaging body 13 is defined by a step-shaped inner wall of thepackaging body 13, wherein a top receiving groove is formed on thepackaging body 13 as installation site for the optical filter 30 beinginstalled and received therein, and then the inner wall of the packagingbody 13 is inwardly and inclinedly extended to the non-photosensitivearea 1112 of the photosensitive element 11 to form the light window 134above the photosensitive area 1111 of the photosensitive element 11 toform the light sensing path (photosensitive path) of the photosensitiveassembly 10. The inclined wall of the light window 134 graduallyincreases the size of the light window from the photosensitive element11 that can substantially reflect the light projected onto the inclinedwall of the light window 134 away from the photosensitive element 11 soas to reduce the adverse influence of the reflected stray light on theimaging quality of the camera module of the present invention.

Referring to FIG. 5A, the packaging body 13 can be alternatively madenot to extend into and fill the gap 125, while the heights of thepackaging body 13, the top surface 111 of the photosensitive element 11and the top surface 1211 of the board body 121 are respectively the sameas the above first embodiment as shown in FIGS. 1-3, wherein, in theimplementation, the photosensitive element 11 and the board body 121 areadhered by an adhesive, such as filling adhering glue in the gap 125, toprevent the packaging body 13 from extending into the gap 125. As shownin FIG. 5B, the packaging body 13 can also alternatively made not onlyextending into the gap 125, but also passing through the gap 125 andwrapping the bottom of the photosensitive assembly 10 to form a bottomlayer of the packaging body 13 covering both the bottom of thephotosensitive assembly 10 and the bottom of the window circuit board12. It should be understood by those skilled in the art that the gap andthe relationship between the packaging body and the gap may be adjustedand configured as desired, and the size of the gap and the formation ofthe packaging body 13, including the extension portion in the gap, areexemplary but not intending to limit the scope of the present invention.

It is worth mentioning that, in another alternative, the board body 121may be in direct contact with the photosensitive element 11 and form nogap therebetween, rather than be spaced from the photosensitive element11 to form the gap 125 therebetween. It is worth mentioning that whenthe packaging body 13 reinforces the window circuit board 12 and thephotosensitive element 11, it does not even require an additionalreinforcing plate provided at the bottom of the circuit board, whereinthe packaging body 13 itself serves to reinforce the window circuitboard. Of course, the back side of the window circuit board 12 of thepresent invention may also be provided with a reinforcing plate toenhance the package strength of the photosensitive assembly.

According to manufacturing process of the photosensitive assembly 10 ofthe present invention, it comprises the steps of windowing a circuitboard substrate to form the window circuit board 12 having the window122, arranging the photosensitive element 11 in the window 122 (thephotosensitive element 11 and the window circuit board 12 may beinitially connected by adhering glue), connecting electrically thephotosensitive element 11 with the board body 121 by the one or moreelectrical connectors 14, for example, by a bonding manner, andintegrally packaging the no-photosensitive area 1112 of thephotosensitive element 11, the one or more electrical connectors 14, theone or more electronic components 123, and the window circuit board 12in an integrally packaging manner to form the photosensitive assembly 10of the present invention.

The material of the board body 121 may be RG (Rigid Flex), FPC (FlexPrint Circuit), PCB (Printed Circuit Board), ceramic substrate (withoutsoft board), and so on.

It is worth mentioning that the package area of the non-photosensitivearea 1112 of the photosensitive element 11 may be configured asrequired, that is, the non-photosensitive area 1112 may be completely orpartially packaged. It should be understood by those skilled in the artthat the size and shape of the package area is not intended to limit thepresent invention.

In the present invention, the packaging body 13 is integrally formed bya molding process (Molding), which is different from the conventionalindependent base or holder that is adhered or bonded to a circuit board.When the photosensitive assembly 10 is manufactured, the photosensitiveelement 11 and the window circuit board 12 are put into a mould, andthen the molding material is fed into the mould, wherein after themolding material is solidified and cured to form the packaging body 13having a predetermined shape, the photosensitive element 11 and thewindow circuit board 12 is integrally fixed by the packaging body 13.The molding material may be selected from the materials of nylon, LCP(Liquid Crystal Polymer), PP (Polypropylene), epoxy resin, and otherthermoplastic or thermosetting materials.

This integrated package reduces the process of the conventionalglue-bonding of the independent base or holder, and the packaging body13 is manufactured by molding, wherein its shape is more easilycontrolled and the surface flatness is better formed, so as to provide aflat mounting condition for the optical filter 30, the driver 40 and thelens 20 and ensure the optical axes of the lens, the optical filter andthe photosensitive element of the camera module to be aligned coaxially.On the other hand, it eliminates the conventional glue bonding spacethat further reduces the height of the camera module. Furthermore,according to the embodiments of the present invention, thephotosensitive element 11 is provided in the window 122 and thenintegrally packaged by the packaging body 13, so that when the packagingbody 13 is formed, the thickness of the photosensitive element 11 willnot increase the overall thickness of the photosensitive assembly 10,which further provides a possibility of reducing the height of thecamera module.

To view the packaging body from the top, its shape can be, but notlimited to, a circular shape, a square shape, a circle shape, or atriangle shape, in order to provide mounting positions for the opticalfilter 30, the lens 20 and/or the driver 40, so that when lens 20 or thedriver 40 is mounted on the packaging body 13, an enclosed internalenvironment is formed. And, the flatness of the surfaces of thepackaging body 13 can be ensured due to the advantages of the integratedpackaging of the mould, so as to provide a better flat mountingcondition for the filter 30, the lens 20 or the driver 40.

According to the above preferred embodiment and its alternatives of thepresent invention, the window 122 is embodied as a through hole, that isthe window 122 communicates both sides of the board body 121 with eachother, so as to provide a space enabling the adjustment of theinstallation position of the photosensitive element 11 in alldirections. In other words, the relative position of the photosensitiveelement 11 in the window 122 and the board body 121 can be configured asnecessary.

It is worth mentioning that, in the present invention, thephotosensitive element 11 and the window circuit board 12 are integrallypackaged by the packaging body 13 so that when the photosensitiveelement 11 is disposed in the window 122, no additional supportingcomponent is required to affix the photosensitive element 11, so thatthe position of the photosensitive element 11 can be relatively andfreely selected. In other words, the packaging body 13 provides a fixingfunction for the photosensitive element 11 and the board body 121 thatintegrally connects the photosensitive element 11 and the board body 121from the top thereof. Therefore, the conventional supporting or fixingmeans for the circuit board body and other components, from the top orother directions, for example underneath, is not needed to use tosupport the photosensitive element 11. In addition, the structuralstrength of the board body 121 of the window circuit board 12 and thephotosensitive element 11 can be enhanced by the integrated packaging ofthe packaging body 13.

Further, according to the first embodiment of the present invention, thephotosensitive element 11 may be positioned closer to an upper portionof the window 122, so that one end of each of the electrical connectors14 is easier to be connected to the non-photosensitive area 1112 of thephotosensitive element 11 while the another end of the respectiveelectrical connector 14 extending across the periphery of the window 122and connecting to the board body 121.

Further, the bottom surface 112 of the photosensitive element 11 and thebottom surface 1212 of the board body 121 are positioned on the samelevel so that the bottom of the photosensitive assembly 10 and thebottom of the board body 121 form a flat bottom surface of thephotosensitive assembly 10. In other words, the bottom surface 112 ofthe photosensitive element 11 and the bottom surface 1212 of the boardbody 121 are substantially flatly aligned with each other.

In this manner, the bottom surface 112 of the photosensitive element 11is exposed to outside to improve the heat-dissipating function of thephotosensitive element 11, that is different from the conventional waythat the photosensitive element is attached on the circuit board thatthe bottom surface of the photosensitive element which is blocked by thecircuit board has a poor thermal dissipating performance.

For example, the present invention provides two methods of manufacturingthe window circuit board 12. One method comprises the steps of windowingthe window 122 in a substrate layer, wherein the size of the window 122is determined in accordance with the size of the photosensitive element11, overlapping the windowed substrate layer with another substratelayer and embedding a circuit between the two substrate layers so as toform the window circuit board 12 having the window 122. In anothermethod, the substrate layers are overlappedly arranged, and the circuitis embedded between the substrate layers in a predetermined route,wherein the embedding route is determined according to the installationposition of the photosensitive element 11, and then windowing theoverlapped substrate layers to form the window 122 which is surroundedby the embedded circuits and determined in accordance with the shape andsize of the photosensitive element 11 without damaging the circuit.

As shown in FIG. 6, a first alternative mode of the first embodiment ofthe present invention is illustrated, wherein the photosensitiveassembly 10 of the camera module is different from the above firstembodiment that, the top surface 111 of the photosensitive element 11 isaligned with the top surface 1211 of the board body 121 on the samelevel. That is, the top surface 111 of the photosensitive element 11 issubstantially flatly aligned with the top surface 1211 of the board body121 to reserve a space below the photosensitive element 11, whereinunder the condition of the top surfaces 111, 1211 of the photosensitiveelement 11 and the board body 121 being flatly aligned with each other,the photosensitive element 11 and the window circuit board 12 areelectrically connected by the one or more electrical connectors 14.

During the manufacturing process of the photosensitive element 11, aboss-shaped smelting device may be provided for supporting thephotosensitive element 11 to ensure the top surface 111 of thephotosensitive element 11 is flatly aligned with the top surface 1211 ofthe window circuit board 12, and then the photosensitive element 11 andthe window circuit board 12 are integrally packaged to form thepackaging body 13 so that the relative positions between thephotosensitive element 11 and the window circuit board 12 is fixed bythe packaging body 13.

As shown in FIG. 7, a second alternative mode of the first embodiment ofthe photosensitive assembly 10 of the camera module is illustrated,wherein the difference between this second alternative mode and thefirst embodiment is that, the photosensitive element 11 includes ablocking member 15, wherein the blocking member 15 is provided at aposition where the packaging body 13 and the photosensitive element 11are in contact with each other to prevent the packaging body 13 fromextending to the inside of the photosensitive element 11, avoiding anycontamination of the photosensitive area 1111 of the photosensitiveelement 11. That is, the blocking member 15 is provided outside of thephotosensitive area 111 to prevent the liquid form molding material fromflowing to the photosensitive area 1111, during the molding process ofthe packaging body 13, and protect the photosensitive element 11 duringthe packaging operation of the mould.

The blocking member 15 is configured to be ring-shaped or frame-shaped,wherein the blocking member 15 is provided on the photosensitive element11. That is, the position where the inner edge of the packaging body 13and the photosensitive element 11 are in contact with each other isblocked by the blocking member 15.

The blocking member 15 may be formed of a colloid or may be a plasticelement having a predetermined shape.

During the manufacturing process of the photosensitive assembly 10,before the photosensitive element 11 and the window circuit board 12 areintegrally packaged, it is preferred to attach the blocking member 15 onthe photosensitive element 11, for example, by coating glue, so as todefine the packaging body 13, with regarding the blocking member 15 as aboundary, and enable the material for the packaging body 13 not tocontaminate the photosensitive area 1111 of the photosensitive element11. In other words, the packaging body 13 is provided from an inner edgeof the blocking member 15 and extended outwardly to encapsulate andpackage at least a portion of the non-photosensitive area 1112 of thephotosensitive element 11, and the electrical connectors 14, the windowcircuit board 13.

Referring to FIGS. 8 and 9, a camera module according to a secondpreferred embodiment of the present invention is illustrated. Thedifferent between this second embodiment and the above first embodimentis that the window 122A is a recess configuration, wherein thephotosensitive element 11 is received and installed in the recessstructure so that the overall height of the photosensitive element 11and the window circuit board 12 is reduced in comparison with theconventional way of attaching the photosensitive element on the circuitboard. Further, when the depth of the recess structured window 122A isequal to or slightly larger than the thickness of the photosensitiveelement 11, the overall thickness of the photosensitive element 11 andthe window circuit board 12 will be simply the thickness of the windowcircuit board 12.

The window 122A has a window bottom 124A and the photosensitive element11 is mounted on the window bottom 124A. In other words, the windowbottom 124A supports the photosensitive element 11. The size of thewindow 122A should match with the size of the photosensitive element 11so that the top surface of the photosensitive element 11 is preferred tobe aligned with the top surface of the board body 121 on the same level.Of course, a gap may be provided between the photosensitive element 11and the board body 121 and the photosensitive element 11 and the boardbody 121 can be fixed by an adhesive.

In this second embodiment of the present invention, the one or moreelectrical connectors 14 are electrically connected to thephotosensitive element 11 and the board body 121. That is, the one ormore electrical connectors 14 are connected with the top surface of thephotosensitive element 11 disposed within the window 122A and the topsurface of the circuit board 12 outside the window 122A.

As shown in FIG. 10, an alternative mode of photosensitive assembly 10of the above second embodiment of the present invention is illustrated.The difference between this alternative mode and the above secondembodiment is that the one or more electrical connectors 14 are disposedin the window 122A of the window circuit board 12 to connect thephotosensitive element 11 with the window circuit board 12. Further, oneend of each of the electrical connectors 14 is connected to thenon-photosensitive area 1112 of the photosensitive element 11 andanother end of the respective electrical connector 14 is connected to arecess surface on the window bottom 124A of the window 122A of thewindow circuit board 12, wherein the electrical connection between theelectrical connectors 14 and the photosensitive element 11 isaccomplished in a smaller space.

In comparison with the manufacturing process of the above firstembodiment, the recess type window 122A of the second embodiment is moredifficult to manufacture than the through hole type window 122. Sincethe thickness of the window circuit board 12 is small and a recess isneeded to be formed in the circuit board to form the window circuitboard 12, it requires a higher accuracy and the electrical connectors 14are connected within the recess (recess type window 122A) while at leasta portion of the circuit has to be printed on a thinner window bottom124A of the window circuit board 12 that requires a higher accuracy toaccomplish. Accordingly, a square shaped window 122A with the electricalconnectors 14 connecting from the photosensitive element 11 to theportion of the window circuit board 12 outside the window 122A ispreferred while providing more adjustable space for the photosensitiveelement 11 to positioned as well as a better thermal dissipatingperformance.

As shown in FIGS. 11 and 12, a camera module according to a thirdpreferred embodiment of the present invention is illustrated. Thedifference between this third embodiment and the above embodiments isthat the photosensitive assembly 10 includes an optical filter 30B whichis directly provided on the photosensitive element 11. That is, theoptical filter 30B covers and shields the photosensitive element 11, soas to further reduce any possible contamination of the photosensitiveelement 11 and damage to the photosensitive element 11 resulting fromthe mould during the molding and packaging process.

In this third embodiment, the top surface of the packaging body 13 maybe a flat and planar surface without the step structure for installingthe optical filter as embodied in the above first and secondembodiments, wherein the lens or the driver 40 is mounted on thepackaging body 13.

For example, the optical filter 30B may be attached to thephotosensitive element 11 by adhesive. In other embodiments, the opticalfilter 30B may also be disposed on the photosensitive element 11 byother attaching means, and it should be understood by those skilled inthe art that the connection mode of the filter 30B and thephotosensitive element 11 is not intended to limit the presentinvention.

In this manner, since the optical filter 30B is provided on top of thephotosensitive element 11, the optical filter 30B is not required to bemounted on the packaging body 13 in the camera module. The distancebetween the optical filter 30B and the photosensitive element 11 isminimized in this third embodiment so that the back focus of the cameramodule is reduced that further reduces the height of the camera module.

In the manufacturing process of the photosensitive assembly 10 accordingto the third embodiment, before the photosensitive element 11 and thewindow circuit board 12 are integrally packaged, the optical filter 30Bmay be firstly attached on the photosensitive element 11 such that thephotosensitive element 11 can be shielded by the optical filter 30B. Inparticular, the photosensitive area 1111 of the photosensitive element11 is shielded and protected by the optical filter 30B so as to preventthe photosensitive element 11 from being contaminated by the packagingmaterial of the packaging body 13 and improve the image quality thereof,during the molding and packaging process. Of course, in otherembodiments of the present invention, the optical filter 30B may beattached on the photosensitive element 11 after the packaging body 13 ismolded to form to reduce the back focal length of the camera module, andit should be understood by those skilled in the art that the sequence ofinstalling the optical filter 30B is not intended to limit the presentinvention.

As shown in FIG. 13, an alternative mode of the photosensitive assembly10 of the camera module according to the third preferred embodiment ofthe present invention is illustrated, wherein the difference betweenthis alternative mode and the above third embodiment is that, thephotosensitive assembly 10 further includes an optical filter 30Battached on the photosensitive element 11 wherein the peripheral of theoptical filter 30B that covers the non-photosensitive area 1112 of thephotosensitive element 11 is also integrally packaged by the packagebody 13. That is, the photosensitive element 11, the window circuitboard 12 and the optical filter 30B are integrally packaged by thepackaging body 13 to form an integral body while affixing the opticalfilter 30B in position at the same time. In the manufacturing process ofthe photosensitive assembly 10 of this alternative mode, the opticalfilter 30B is overlappedly attached on the photosensitive element 11 byadhesive before the packaging body 13 is molded and packaged to form, orthat the filter 30B may also be integrally molded and packaged inposition on top of the photosensitive element 11 without such adheringstep.

As shown in FIG. 14, a camera module according to a fourth preferredembodiment of the present invention is illustrated. The differencebetween this fourth embodiment and the above embodiments is that thephotosensitive assembly 10 includes a hollow packaging body 13C whichcomprises a holding portion 131C and a lens portion 132C. The holdingportion 131C is configured for mounting the filter 30 thereat, and thelens portion 132C is upwardly extended for mounting the lens 20 therein.

Further, the lens portion 132C of the packaging body 13C extendsintegrally and upwardly from the holding portion 131C defining therein areceiving chamber which inner wall forms a stepped structure defining aring shaped first supporting table 1311C at the holding portion 131C anda ring shaped second supporting table 1321C at the lens portion 132C,wherein the optical filter 30 is mounted on the first supporting table1311C and the lens 20 is mounted on the second supporting table 1321C.In other words, the first supporting table 1311C and the secondsupporting table 1321C form a two-stepped structure.

The lens portion 132C is integrally extended to provide a stablemounting environment for the lens 20. According to this third embodimentof the present invention, the depth of the lens portion 132C can bedetermined in accordance with the height of the lens 20 for mounting thelens 20 stably therein, so as to improve the accuracy of the cameramodule.

According to the fourth embodiment, the packaging body 13C is made bymolding and packaging to form an integral packaging body with a smoothand stable mounting environment for mounting the lens 20 therein form afixed focus camera module.

Furthermore, in this fourth embodiment, the inner wall of the lensportion is made flatly which is suitable for mounting the non-threadedlens 20 thereon.

As shown in FIG. 15, an alternative mode of the camera module accordingto the fourth preferred embodiment of the present invention isillustrated. The difference between this alternative mode and the fourthembodiment is that the inner wall of the lens portion 132C has athreaded structure 1322C adapted for mounting a threaded lens thereon.Of course, in other embodiments, the interior of the lens portion mayalso be other different structures to facilitate installation ofdifferent types of lens.

FIG. 16 is a sectional view of a camera module according to a fifthpreferred embodiment of the present invention. The difference betweenthis fifth embodiment and the above embodiments is that thephotosensitive assembly 10 further includes a substrate 16 disposedbelow the photosensitive element 11.

Furthermore, the bottom of the substrate 16 and the bottom surface 1212of the board body 121 are substantially aligned on the same levelforming a flat bottom surface of the photosensitive assembly 10. Inaddition, it is preferred that the thickness of the photosensitiveelement 10 plus the thickness of the substrate 16 is equal to orslightly smaller than the depth of the window 122 of the window circuitboard 12. In other words, the substrate 16 fills the remaining spacebelow the photosensitive element 10 installed in the window 122, suchthat when the thickness of the photosensitive element 11 is smaller thanthe thickness of the board body 121 and the photosensitive element 11 isarranged to level closely to or at the top surface 1211 of the boardbody 121, the flatness of the bottom of the photosensitive assembly 10can be maintained by means of the substrate 16 to avoid any protrudingstructure at the bottom surface of the photosensitive assembly 10.

The substrate 16 may also enhance the structural strength of thephotosensitive assembly 10 as well as the heat dissipation performance.In an embodiment, the substrate 16 can be a metal plate or a plasticplate. In another embodiment, the substrate 16 may be a film layerattached to the bottom surface 112 of the photosensitive element 11 toprotect the photosensitive element 11 and enhance the structuralstrength and heat dissipation performance of the photosensitive element11. For example, but not limited to, the film layer is a metal coatingadapted to be coated on the bottom surface 112 of the photosensitiveelement 11.

The substrate 16 may be bonded to the circuit board body 121 or bondedto the photosensitive element 11 by adhesive.

Of course, in other embodiments, the substrate 16 may be disposed belowthe board body 121 that, for example, when the thickness of thephotosensitive element 11 is larger than the thickness of the circuitboard body 121, the height difference between the photosensitive element11 and the board body 121 may be made up by the substrate 16 so as tomaintain the flatness of the bottom surface of the photosensitiveassembly 10.

As shown in FIG. 17, an alternative mode of the photosensitive assemblyof the camera module according to the fifth preferred embodiment of thepresent invention is illustrated. The difference between thisalternative mode and the above fifth embodiment is that the windowcircuit board 12 further includes a substrate 16D, which is received inthe window 122 of the window circuit board 12, and that the substrate16D has a receiving slot indently formed in the top surface thereof tofittingly receive the photosensitive element 11 therein. That is, thesubstrate 16D provides a mounting site for mounting the photosensitiveelement 11 in position so that the top surface of the photosensitiveelement 11 and the board body 121 are aligned with each other at thesame level, and that the bottom surface of the substrate 16D issubstantially aligned at the same level with the bottom surface of theboard body 121 so as to maintain the flatness of bottom surface of thephotosensitive assembly 10.

As shown in FIG. 18, a camera module according to a sixth preferredembodiment of the present invention is illustrated. The differencebetween this sixth embodiment and the above embodiments is that, theboard body 121 of the window circuit board 12 has at least onereinforcing hole 1213 formed therein, and, correspondingly, thepackaging body 13 has at least one inserting portion extended into thereinforcing hole 1213 so as to further engage the packaging body 13 withthe window circuit board 12 that can further reinforce the structuralstrength of the board body 121. The number and the depth of thereinforcing holes 1213 may be arranged as needed and the reinforcingholes 1213 should be provided at positions where the circuit is notprovided.

In this sixth embodiment, the reinforcing hole 1213 can be a concavehole, such that both sides of the board body 121 are not communicatewith each other through the reinforcing hole 1213.

FIG. 19 illustrates an alternative mode of the photosensitive assembly10 of the camera module according to the sixth preferred embodiment ofthe present invention. The difference between this alternative mode andthe above sixth embodiment is that the circuit board body 121 of thewindow circuit board 12 has at least one reinforcing hole 1213E which isa through hole communicating both sides of the board body 121 with eachother, wherein the packaging body 13 has an inserting portion extendedinto the reinforcing hole 1213E so as to further engage the packagingbody 13 with the window circuit board 12 that can further reinforce thestructural strength of the board body 121.

Furthermore, according to this alternative mode, the packaging body 13further comprises a packaging layer 133E attached to the bottom of theboard body 121 and the photosensitive element 11 while the insertingportion of the packaging body 13 passes through the reinforcing hole1213E and is extended to the bottom of the board body 121 and thephotosensitive element 11 to integrally connect with the packaging layer133E to form the photosensitive assembly 10 as an integral body, whereinthe packaging layer 133E further reinforces the structural strength ofthe photosensitive assembly 10.

In other words, in this alternative mode, the packaging body 13 is notonly formed on top of the board body 121 and an upper portion of thephotosensitive element 11, but also integrally formed at the bottom ofthe board body 121 and the lower portion of the photosensitive element11. Of course, in other embodiments, the packaging layer 133E may bemerely formed below the board body 121, but not covering thephotosensitive element 11.

As shown in FIG. 20, a camera module according to a seventh preferredembodiment of the present invention is illustrated. The differencebetween this seventh embodiment and the above embodiments is that, thephotosensitive assembly 10 includes a backplane 17, wherein thebackplane 17 is attached to the bottom of the board body 121 toreinforce the structural strength of the board body 121, so as to ensurethe flatness of the bottom of the photosensitive assembly 10. In oneembodiment, the backplane 17 may be a metal plate that not only canenhance the structural strength of the photosensitive assembly 10, butalso can increases the heat dissipation performance of thephotosensitive assembly 10. In one embodiment, the backplane 17 may be afilm layer attached to the bottom surface 112 of the photosensitiveelement 11 and the bottom surface 1212 of the board body 121, so as toprotect the photosensitive element 11 and the board body 121 whileenhancing both the heat dissipation performance and the structuralstrength of the photosensitive element. For example, but not limited to,the film layer is a metal coating coated on the bottom surfaces 112,1212 of the photosensitive element 11 and the board body 121.

Referring to FIG. 21, a camera module according to an eighth preferredembodiment of the present invention is illustrated. The differencebetween this eighth embodiment and the above embodiments is that thecamera module further includes a holder 50 which is mounted on thepackaging body 13 and the optical filter 30 is mounted on the holder 50.

Further, the holder 50 may have a bent structure so that one end portionthereof is adapted to be mounted on the packaging body 13 while anotherend portion is configured to support the optical filter 30 in position.

The holder 50 is preferred to be inwardly and downwardly extended toreduce the distance between the optical filter 30 and the photosensitiveelement 11 so as to reduce the back focus of the camera module.

In this eighth embodiment, a mounting site is provided for the opticalfilter 30 by the holder 50 rather than by packaging body 13 directly asshown in the above embodiments. It is worth mentioning that thestructure shown in Figures of the present invention is merely as anexemplary but not as a limitation of the present invention. Since theoptical filter 30 has a smaller structural strength, the mounting siteis required in a larger scale when it is mounted. Accordingly, the widthof the mounting portion of the integrated package portion of thepackaging body 13 can be reduced by the presence of the holder 50 whileproviding a larger structural strength thereof.

The holder 50 has a ring shape or a frame structure, viewing from thetop, or may be selectively provided on one or more sides of thepackaging body 13 or the optical filter 30.

Referring to FIG. 22 a camera module according to a ninth preferredembodiment of the present invention is illustrated. The differencebetween this ninth embodiment and the above embodiments is that, thecamera module is embodied as an arrayed camera module which may includetwo or more photosensitive assemblies 10, two or more lenses 20, two ormore drivers 40, and two or more optical filters 30 forming two or morecamera module units respectively. According to the ninth embodiment, twocamera module units are embodied as an example to illustrate theconfiguration of the array camera module of the present invention.

It is worth mentioning that, for purpose of illustrating the presentinvention, a dual camera module is embodied in this ninth embodiment ofthe present invention, wherein the dual camera module comprises twolenses 20, taken as an example, whereas in other embodiments of thepresent invention, the number of lenses 20 may be more, such as three ormore. It is appreciated that those skilled in the art would understandthat the number of lenses 20 and the number of the correspondingcomponents, such as the driver 40, the optical filter 30, the packagingbody 13, and/or the holder 50, are not limitation to the scope of thepresent invention.

More specifically, in this ninth embodiment of the present invention,the photosensitive assembly 10 comprises two window circuit boards 12integrally connected to form an integral board body so as to form anarray structure. The two packaging bodies 13 may be an integratedstructure packaged on the two window circuit boards 12 to form twowindows corresponding for the two photosensitive elements 11 at one timeto provide two light paths for the two lenses 20 respectively.Alternatively, the two packaging bodies can also be two independentbodies, each having a window for the respective photosensitive element11, respectively packaged on the two window circuit boards 12.

In the present invention, multiple embodiments and differentimplementation are disclosed. In the description, for purposes ofbrevity and clarity of description, distinctive features are describedin the different embodiments and implements, but in the specificimplementation, different features of different embodiments andembodiments may be combined as needed to form different camera modulesor photosensitive assemblies 10, and it should also be understood bythose skilled in the art that the camera module and the photosensitiveassembly 10 are not limited to what is disclosed by the singleembodiment or implementation as described in the present invention.

Referring to FIG. 23, according to the above mentioned preferredembodiments of the present invention, the present invention provides amethod 1000 of manufacturing a photosensitive assembly 10, whichcomprises the steps of:

1100: arranging at least one photosensitive element 11 in a window 122of at least one window circuit board 12;

1200: connecting electrically the photosensitive element 11 with thewindow circuit board 12; and

1300: integrally forming a packaging body 13 which is integrated withthe photosensitive element 11 and the window circuit board 12 andforming a light window 131 in the packaging body 13 aligned along alight path of the photosensitive element 11.

In the step 1100, the window 122 may be an indented recess or athrough-hole.

Before the step 1100, the method may further comprise a step of: formingat least one window circuit board 12 having at least one window 122;

In the step 1100, the photosensitive element 11 may be provided on aside near the top surface of the window circuit board 12 so that the topsurfaces of the photosensitive element 11 and the window circuit board12 are aligned with each other. It should be understood that the mannerin which the top and bottom surfaces are substantially aligned with eachother is merely by way of example only and is not limiting of thepresent invention.

In the step 1200, the photosensitive element 11 and the window circuitboard 12 are electrically connected by one or more electrical connectors14. In the step 1200, one end of each of the electrical connectors 14 isconnected to the photosensitive element 11, and another end of therespective electrical connector 14 is connected to the window circuitboard 12.

In the step 1300, the method 1000 further comprises a step of packagingintegrally the photosensitive element 11, the electrical connector 14and the electronic component 123 protruding from the window circuitboard 12.

The method 1000 may also include a step 1400 of: attaching, such asbonding, an optical filter 30 to the corresponding photosensitiveelement 11. The step 1400 may be executed before the step 1300 or afterthe step 1300.

The method 1000 may further include a step 1500 of: forming at least onereinforcing hole 1213 in the board body 121 of the window circuit board12 and extending the packaging body 13 into the reinforcing hole.

The method 1000 may also include a step 1600 of: attaching a backplane17 to the bottom of the window circuit board 12.

In one embodiment, in the step 1300, the photosensitive element 11 andthe window circuit board 12 are brought into contact, and the packagingbody 13 integrally connects the photosensitive element 11 and the windowcircuit board. 12 to form the photosensitive assembly 10 as an integralbody.

In another embodiment, in the step 1300, the photosensitive element andthe window circuit board 12 are spacedly arranged to form a gap betweeneach other, and the packaging body 13 is integrally connected and filledbetween the photosensitive element 11 and the window circuit board 12 toreinforce the photosensitive element 11 and the window circuit board 12.

In another embodiment, in the step 1300, a medium is filled between thephotosensitive element 11 and the window circuit board 12 to connectthem with each other, wherein the packaging body 13 integrally connectsthe photosensitive element 11, the medium, and the window circuit board12. For example, curing at least portion of the periphery of thenon-photosensitive area 1112 of the photosensitive element 11 byadhering glue to connect the photosensitive element 11 and the windowcircuit board 12 with each other.

The integrated package method can be processed by a molding process, forexample, employing an insert molding or a compression molding process byan injection molding machine.

One skilled in the art will understand that the embodiment of thepresent invention as shown in the drawings and described above isexemplary only and not intended to be limiting.

The embodiments have been shown and described for the purposes ofillustrating the functional and structural principles of the presentinvention and is subject to change without departure from suchprinciples. Therefore, this invention includes all modificationsencompassed within the spirit and scope of the following claims.

What is claimed is:
 1. A photosensitive assembly for assembling at leasta camera module comprising at least one lens, comprising: at least onewindow circuit board comprising a board body which has at least a windowformed therein and a circuit provided outside said window in said boardbody; at least one photosensitive element installed in said window andelectrically connected with said window circuit board through one ormore electrical connectors, so that an overall thickness of said windowcircuit board and said photosensitive element is smaller than athickness of said window circuit board plus a thickness of saidphotosensitive element; wherein said photosensitive element forms aphotosensitive area and a non-photosensitive area surrounding saidphotosensitive element on a top side thereof; and at least one packagingbody provided around said photosensitive area of said photosensitiveelement above said window circuit board adapted for installing the lensthereon to form the camera module, wherein at least a portion of saidnon-photosensitive area of said photosensitive element, at least aportion of top side of said window circuit board and said electricalconnectors are integrally packaged by said packaging body to define alight window within said packaging body, wherein said light window isaligned with said window of said window circuit board to define a lightpath for said photosensitive area of said photosensitive element adaptedfor aligning with the lens installed on said packaging body, wherein atleast a portion of said packaging body is extended to bond side edges ofsaid photosensitive element with an inner wall of said window circuitboard defining said window.
 2. The photosensitive assembly, as recitedin claim 1, wherein a gap is provided between said photosensitiveelement and said packaging body extends into said gap to form aninserting portion bonding said side edges of said photosensitive elementwith said inner wall so as to reinforce and strengthen the integralstructure of said photosensitive element, said window circuit board andsaid packaging body of said photosensitive assembly.
 3. Thephotosensitive assembly, as recited in claim 1, wherein said window isan indented recess and said photosensitive element is received in saidrecess.
 4. The photosensitive assembly, as recited in claim 3, whereinone end of each of said electrical connectors is electrically connectedto said non-photosensitive area of said photosensitive element andanother end of each of said electrical connectors is electricallyconnected to a top side of said recess of said window.
 5. Thephotosensitive assembly, as recited in claim 1, wherein said window is athrough hole, wherein one end of each of said electrically connectors iselectrically connected to said non-photosensitive area of saidphotosensitive element and another end of each of said electricallyconnectors is electrically connected with said circuit provided on saidtop side of said board body of said window circuit board.
 6. Thephotosensitive assembly, as recited in claim 1, wherein said thicknessof said photosensitive element is thinner than a depth of said window.7. The photosensitive assembly, as recited in claim 6, furthercomprising a substrate attached to a bottom of said photosensitiveelement.
 8. The photosensitive assembly, as recited in claim 5, whereinsaid packaging body further comprises a packaging layer integrallypackaged at a bottom of said board body.
 9. The photosensitive assembly,as recited in claim 2, wherein said packaging body further comprises apackaging layer extended from said inserting portion and integrallypackaged with at least a bottom of said board body.
 10. Thephotosensitive assembly, as recited in claim 7, wherein said packagingbody further comprises a packaging layer integrally packaged withbottoms of said board body and said substrate.
 11. The photosensitiveassembly, as recited in claim 1, further comprising an optical filterprovided on said photosensitive element.
 12. The photosensitiveassembly, as recited in claim 1, further comprising an optical filterprovided on said photosensitive element, wherein said packaging bodyextended to a periphery of said optical filter so that said windowcircuit board, said photosensitive element and said optical filter areintegrally packaged by said packaging body.
 13. The photosensitiveassembly, as recited in claim 1, further comprising an optical filterinstalled at an installation site of said packaging body and positionedabove said photosensitive element.
 14. The photosensitive assembly, asrecited in claim 1, wherein said packaging body further comprises a lensportion upwardly extended to define a lens receiving chamber on top ofthe light window therein for installing the lens therein.
 15. Thephotosensitive assembly, as recited in claim 1, further comprising ablocking element which is provided at a position where said packagingbody and said photosensitive element are in contact with each other andoutside said photosensitive area of said photosensitive element toprevent said packaging body from extending to said photosensitive areaof said photosensitive element.
 16. The photosensitive assembly, asrecited in claim 15, wherein said blocking member is configured to bering-shaped and formed of a colloid element having a predeterminedshape.
 17. The photosensitive assembly, as recited in claim 2, furthercomprising a blocking element which is provided at a position where saidpackaging body and said photosensitive element are in contact with eachother and outside said photosensitive area of said photosensitiveelement to prevent said packaging body from extending to saidphotosensitive area of said photosensitive element.
 18. A method ofmanufacturing a photosensitive assembly for assembling at least a cameramodule, comprising the steps of: (a) providing at least a window in aboard body of a window circuit board which has at least a circuitprovided outside said window; (b) installing at least one photosensitiveelement in said window and electrically connecting said photosensitiveelement with said window circuit board; and (c) integrally packaging atleast one packaging body on said window circuit board so as to integratesaid photosensitive element and said window circuit board with saidpackaging body to form said photosensitive assembly while defining alight window in the packaging body aligned with the photosensitiveelement to form a light path, wherein at least a portion of saidpackaging body is extended to bond side edges of said photosensitiveelement with an inner wall of said window circuit board defining saidwindow.
 19. The method, as recited in claim 18, further comprising astep (d) of mounting an optical filter at an installation site of saidpackaging body and aligning said optical filter along said light path.20. The method, as recited in claim 84, wherein the step (b) furthercomprises a step of providing an optical filter on said photosensitiveelement, wherein the step (c) further comprises a step of integrallypackaging at least a periphery portion of said optical filter so thatsaid optical filter, said photosensitive element, said window circuitboard are integrally packaged by said packaging body to form an integralbody as said photosensitive assembly.
 21. The method, as recited inclaim 18, further comprising a step of providing a ring-shaped blockingelement at a position where said packaging body and aid photosensitiveelement are in contact with each other and outside said photosensitivearea of said photosensitive element.
 22. The method, as recited in claim18, further comprising the steps of providing at least one reinforcinghole in said window circuit board and extending an inserting portion ofsaid packaging body into said reinforcing hole to further engaging saidpackaging body with said window circuit board.
 23. The method, asrecited in claim 21, further comprising the steps of providing at leastone reinforcing hole in said window circuit board and extending aninserting portion of said packaging body into said reinforcing hole tofurther engaging said packaging body with said window circuit board.